• As semiconductor circuit line widths are nanosizing, electrostatic problems(ESA, ESD) often occur in the cleaning process.

• ESA (Electrostatic Attraction) : Critical factor of particle absorption on wafers.
• ESD (Electrostatic Discharge) : It causes problems (arcing, wafer pattern defects, and fire).
• Semiconductor yield is reduced due to equipment malfunction, wafer damage, etc.
• Problems with contaminants on semiconductor circuits and wafers (backside particle etc.).

• Antistatic Solution comparison

• CB=Carbon Black
• TOC dissolution conditions : 80℃, 1hr
• SEMI E78 : ESDS(Electrostatic discharge sensitive) wafer’s charge at approximately 30 cm around the wafer must be managed to be less than 100 V.
•  : Difficult to apply in Industry

- Chemical Resistance Test

- ICP-MS(Metal leaching) Test

• If you use grounding and antistatic materials together, you can stably manage static electricity in the cleaning chamber.

• High heat resistance
• High chemical resistance
• High abrasion resistance
• Surface resistance of antistatic range (1×10⁵~1×10⁹Ω/sq)

• Semiconductor cleaning process equipment parts : bowl, chuck, nozzle, bath, tank, pipe line, tube, fitting etc.
• Semiconductor etching, photo process equipment parts
• Replacement of fluoropolymer parts requiring antistatic properties

• Semiconductor industry
• Display industry
• Chemical industry

• Please contact us for more details.